CONN FPC BTM 15POS 0.3MM SMD R/A
Japan Aviation Electronics Industry
0.5 FPC ZIF BTM CONT EMBT PKG 11
Molex
間距:0.5mm;觸點數(shù)量:34P;鎖定特性:翻蓋式;安裝類型:臥貼;觸點類型:下接;工作溫度范圍:-;
BOOMELE
間距:0.5mm;觸點數(shù)量:26P;鎖定特性:翻蓋式;安裝類型:臥貼;觸點類型:下接;工作溫度范圍:-20℃~+85℃;
HDGC
間距:1mm;觸點數(shù)量:6P;鎖定特性:翻蓋式;安裝類型:臥貼;觸點類型:下接;工作溫度范圍:-;焊接溫度(最大值):-;
HR
間距:0.5mm;觸點數(shù)量:24P;鎖定特性:抽屜式;安裝類型:臥貼;觸點類型:下接;
HR
15 Position FFC, FPC Connector Contacts, Vertical - 1 Sided 0.039" (1.00mm) Surface Mount
CviLux
間距:0.3mm;觸點數(shù)量:39P;鎖定特性:翻蓋式;安裝類型:臥貼;觸點類型:下接;工作溫度范圍:-25℃~+85℃;
TXGA
12 Position FFC, FPC Connector Contacts, Bottom 0.020" (0.50mm) Surface Mount, Right Angle
GCT
FPC spacing 1.00mm 16Pins H=2.00mm clamshell bottom connection
JS
