
間距:0.5mm;觸點(diǎn)數(shù)量:22;鎖定特性:翻蓋式;安裝類型:臥貼;觸點(diǎn)類型:下接;工作溫度范圍:-25℃~+85℃;
TXGA

間距:0.5mm;觸點(diǎn)數(shù)量:60P;鎖定特性:翻蓋式;安裝類型:臥貼;觸點(diǎn)類型:雙側(cè)觸點(diǎn)/上下接;工作溫度范圍:-25℃~+85℃;
XUNPU

14 Position FFC, FPC Connector Contacts, Bottom 0.020" (0.50mm) Surface Mount, Right Angle
GCT

EVALUATION POD, FOR PSOC CY8C24X94; IC Product Type:Debugger; Silicon Family Name:PSoC 1; Core Architecture:M8C; Core Sub-Architecture:M8C; Kit Contents:CY8C24x29 PSoC EvalPod; Features:Standalone Device without Debugging Capability; Product Range:-; SVHC:No SVHC (17-Dec-2015); Accessory Type:Emulation Pod; Development Tool Type:Evaluation Board; For Use With:CY3215-DK Kit; Kit Features:Connect to the ICE In-Circuit Emulator to Allow Debugging Capability, Prototyping Header; Supported Devices:CY8C24094, CY8C24994, CY8C24894, CY8C24794; Type:Hardware / Software - Dev Kit (Dev Tool)
Infineon

間距:0.5mm;觸點(diǎn)數(shù)量:5;鎖定特性:翻蓋式;安裝類型:臥貼;觸點(diǎn)類型:雙側(cè)觸點(diǎn)/上下接;工作溫度范圍:-55℃~+85℃;
HDGC


