卡連接方式:自彈式;卡類型:MiniSIM卡;連接器類型:卡座;本體最大高度:1.88mm;觸頭材質(zhì):-;觸頭鍍層:-;工作溫度范圍:-;
HYC
1MM MINI CARD GUIDE ASSEMBLY
Samtec
工作溫度范圍:-25℃~+85℃;本體最大高度:1.95mm;連接器類型:卡座;卡類型:MicroSD卡(TF卡);卡連接方式:自彈式;
Foxconn
Connector, Compact Flash Card, 50Pos; Memory / Card Type:compactflash Card; Insert & Eject Mechanism:-; No. Of Contacts:50Contacts; Contact Material:phosphor Bronze; Contact Plating:gold Plated Contacts; Product Range:53856 Series Rohs Compliant: Yes
Molex
TE Connectivity (Tyco Electronics)
1MM MINI CARD GUIDE ASSEMBLY
Samtec
CONN SMART CARD PUSH-PULL R/A
Amphenol
卡連接方式:拔插式;卡類型:MicroSD卡(TF卡);連接器類型:卡座;本體最大高度:1.9mm;工作溫度范圍:-;
SOFNG
CONN SKT SODIMM 200POS R/A SMD
TE Connectivity (Tyco Electronics)
MICRO SIM卡座PUSH 1.35H 6P
HDGC
