
適用IC封裝類型:DIP;間距:2.54mm;總針腳數(shù):20;行距:7.62mm;圓孔/方孔:圓孔;工作溫度范圍:-40℃~+105℃;
XKB

Dip Socket, 40 Position, Through Hole; No. Of Contacts:40Contacts; Connector Type:dip Socket; Pitch Spacing:2.54Mm; Product Range:800 Series; Row Pitch:15.24Mm; Contact Material:beryllium Copper; Contact Plating:gold Plated Contacts Rohs Compliant: Yes
TE Connectivity (Tyco Electronics)







