CONN SOCKET PGA 180POS GOLD
Preci-Dip
適用IC封裝類型:DIP;間距:2.54mm;總針腳數(shù):10;行距:15.24mm;圓孔/方孔:圓孔;工作溫度范圍:-40℃~+105℃;
XKB
CONN SOCKET PGA 20POS GOLD
Preci-Dip
CONN IC DIP SOCKET 6POS GOLD
Preci-Dip
CONN HDR STRIP SOLDER 20POS GOLD
Mill-Max
CONN SOCKET PGA 142POS GOLD
Preci-Dip
TE Connectivity (Tyco Electronics)
CONN SOCKET 12POS 0.1 GOLD SMD
Preci-Dip
CONN IC DIP SOCKET 14POS GOLD
CNC Tech
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip