適用IC封裝類(lèi)型:DIP;間距:2.54mm;總針腳數(shù):16;行距:7.62mm;圓孔/方孔:圓孔;工作溫度范圍:-40℃~+105℃;
XFCN
CONN SOCKET PGA 257POS GOLD
Preci-Dip
CONN IC DIP SOCKET 6POS GOLD
Preci-Dip
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
CONN SOCKET PGA 305POS GOLD
Preci-Dip
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Preci-Dip
120 μF 420 V Aluminum Electrolytic Capacitors Radial, Can 5000 Hrs @ 105°C
Rubycon
SOCKET ADAPTER SSOP TO 28DIP
Logical Systems