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Silicon Manufacturer:nxp; Core Architecture:coldfire; Core Sub-Architecture:coldfire V1; Silicon Core Number:mcf51; Silicon Family Name:flexis - Mcf51Mm; For Use With:twr-Mcf51Mm Or Twr-S08Mm128 Tower System Modules; Product Range:- Rohs Compliant: Yes

FLUOROCARBON-116 O-RING

FLUOROCARBON -325 O-RING

SILICONE -116 O-RING

Daughter Board, For Kit Pressure1Evb; Kit Application Type:sensing - Pressure; Silicon Manufacturer:nxp; Silicon Core Number:mpl115A1; Application Sub Type:pressure Sensor; Kit Contents:board Only; Product Range:- Rohs Compliant: Yes

2.54mm 圓孔排針,雙排,180度,塑高3.0mm,塑寬5.08mm,D4.0mm,L=11.96mm,PPS料,鍍金,2x07P

TOOLBOX STARTER KIT, SENSOR'S; Kit Application Type: Sensing - Sampling Kit, Related Components; Silicon Manufacturer: NXP; Silicon Core Number: MPR03X; Application Sub Type: Various Sensor Kits; Kit Contents: Development Board, Communication Board, Development Module; Product Range: -; SVHC: No SVHC (27-Jun-2018); Core Architecture: Sensor; Core Sub-Architecture: Pressure Sensor; Development Tool Type: Starter kit; Kit Contents Descriptive: LFSTBEB7660 Accelerator Development board, LFSTBUSB Accelerator communication board, KITPRESSURE1EVB pressure sensor communication board, KITMPXV5004DPEVB pressure sensor development kit, KITMPR03XEVM Proximity sensor development module, all documents are included in the kits.; Type: Hardware / Software - Starter Kit

2.54mm 圓孔排針,雙排,180度,塑高3.0mm,塑寬5.08mm,D3.5mm,L=10.0mm,PPS料,鍍金,2x18P

FLUOROCARBON -215 O-RING

Ref Design Board, Health Sensor Platform; Silicon Manufacturer:-; Silicon Core Number:max32620, Max30003, Max30205, Max30101, Lis2Dh, Lsm6Ds3, Bmp280; Kit Application Type:medical - Health Platform; Application Sub Type:embedded Rohs Compliant: Yes