HMC608LC4是一款高動(dòng)態(tài)范圍GaAs pHEMT MMIC中等功率放大器，采用無引腳“無鉛”SMT封裝。該放大器提供兩種工作模式：高增益模式（Vpd引腳短接至地）；和低增益模式（Vpd引腳保持開路）。下表顯示了在高增益模式下工作的放大器的電氣規(guī)格。該放大器具有9.5至11.5 GHz的工作范圍，提供29.5 dB增益、+27.5 dBm飽和功率和23% PAE（+5V電源電壓）。噪聲系數(shù)為6 dB，而輸出IP3為+33 dBm。隔直RF I/O匹配至50 Ω，使用方便。HMC608LC4無需線焊，可以使用表貼制造技術(shù)。
輸出IP3：+33 dBm
飽和功率：+27.5 dBm (23% PAE)
增益：29.5 dB
電源：+5V（310 mA時(shí)）
50 Ω匹配輸入/輸出
符合RoHS標(biāo)準(zhǔn)的4x4 mm SMT封裝
應(yīng)用
點(diǎn)對(duì)點(diǎn)無線電
點(diǎn)對(duì)多點(diǎn)無線電
軍用最終用途
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