Although iPOWIR technology based designs represent a unique class of power solutions, the design of the printed circuit board (PCB) is a simple but effective means of optimizing the performance of an iPOWIR solution. In general, there are a number of issues that need to be
considered when designing a power supply layout. These issues apply to both discrete and iPOWIR solutions. This application note describes how to optimize the layout for thermal and electrical properties.
Method Recommended Footprint An iPOWIR solution must be mated to the proper PCB footprint. This will ensure good electrical, thermal, and mechanical connections and will assure a reliable product.Land pads on the PCB should be solder mask defined.The solder mask openings for the land pads are typically 80% of the solder ball diameter. This will provide the optimum standoff height1. Refer to the individual product datasheets for actual pin-out and footprint recommendations.