The Leadless Leadframe Package （LLP） is a leadframe based chip scale package （CSP） that may enhance chip speed， reduce thermal impedance， and reduce the printed circuit board area required for mounting. The small size and very low profile make this package ideal for high density PCBs used in small-scale electronic applications such as cellular phones， pagers， and handheld PDAs. The LLP package is offered in the Pullback and no Pullback configuration. In the Pullback configuration the standard solder pads are offset from the edge of the package by 0.1 mm. In the no Pullback configuration the standard solder pads extend and terminate at the edge of the package. This feature offers a visible solder fillet after board mounting. The LLP has the following advantages： ? Low thermal resistance ? Reduced electrical parasitics ? Improved board space efficiency ? Reduced package height ? Reduced package mass JEDEC Registration Information： ? Quad LLP Packages： MO-220 ? Dual-in-line LLP Packages： MO-229