Cree XLamp?優(yōu)化LED PCB的熱性能

　　1。介紹

　　這個(gè)設(shè)計(jì)筆記概述協(xié)助開發(fā)成本有效的熱管理XP和XLamp LED MX家庭技術(shù)。

　　LED照明系統(tǒng)中最關(guān)鍵的設(shè)計(jì)參數(shù)之一是該系統(tǒng)能夠?qū)崃繌腖ED接點(diǎn)中分離出來。LED連接處的高工作溫度對(duì)發(fā)光二極管的性能產(chǎn)生不利影響，導(dǎo)致光輸出和壽命縮短1。為了正確地管理這種熱量，照明應(yīng)用中LED的設(shè)計(jì)、組裝和操作應(yīng)遵循特定的做法。

　　本應(yīng)用說明概述了一種設(shè)計(jì)低成本印刷電路板（PCB）布局的技術(shù)，它優(yōu)化了LED的熱量傳遞。該技術(shù)涉及使用的多氯聯(lián)苯的FR-4為基礎(chǔ)，成本較低，但比金屬芯印刷電路板（MCPCB）更大的熱阻。使用金屬內(nèi)襯孔或通孔的下面是一個(gè)LED的散熱墊散熱通過fr-4-pcb和成適當(dāng)?shù)纳岱椒ā?/p>

　　Using metalized vias is a technique available to the LED packaging used by Cree XLamp LEDs. Electrically isolated thermal pads are a requirement for using this technique. For certain illumination systems design， thermal vias enable the use of FR-4 circuit boards over metal core circuit boards. This can deliver system cost savings in circuit board and heat sink selection.

　　This application note serves as a practical guideline based on heat transfer fundamentals and includes suggestive， but not definitive， simulation and measurement data. Cree advocates this technique as appropriate design for certain lighting applications and encourages Cree’s customers to evaluate this option in considering the many thermal management techniques available. For additional guidelines on LED thermal management refer to application note， Cree XLamp LED Thermal Management.