The 3B Series of Signal Conditioning I/o Subsystems provide a low-cost， versatile method of transferring analog transducer signals to a data acquisition， monitoring or control system without the inherent noise， non-linearity， drift and extraneous voltages. The modules are designed to directly accept analog signals from Thermocouples， RTD’s， AC and DC Strain Gages， Torque Transducers， Frequency Transducers， LVDTs， millivolt or process current signals. The modules amplify， isolate， linearize and convert the transducer output signals to standardized analog inputs for high-level analog I/O subsystems. The 3B Series Subsystem consists of a 10” relay rack with universal mounting backplane and a family of plug-in （up to 16 per rack） input and output signal conditioning modules. Eight and four channel backplanes are also available. Each backplane incorporates screw terminals for sensor inputs and current outputs and a 26-pin connector for high-level singleended voltage outputs to the user’s equipment. The input modules feature complete signal conditioning circuitry optimized for specific sensors or analog signals and provide two simultaneous high-level analog outputs： 0 to +10V （or +10V） and 4-20 mA （or 0-20 mA）。