概述了電子設(shè)備行業(yè)為了實(shí)現(xiàn)小型、輕量化與高速、大容量的信息傳輸，對(duì)電子元器件及裝 置實(shí)施小型化、高密度組裝、微細(xì)導(dǎo)線、最短連線所需的三維組裝和立體電路成形技術(shù)。論述了電子 元器件組裝中所采用的高分子材料及對(duì)其高性能的期望、金屬與高分子材料的連接所應(yīng)用的界面 控制技術(shù)。討論了界面控制技術(shù)的具體應(yīng)用，如多層線路板、半導(dǎo)體密封材料、異向性導(dǎo)電連接材 料、半導(dǎo)體制造工程用粘結(jié)帶等。
關(guān)鍵詞：系統(tǒng)內(nèi)組裝；微內(nèi)部連接；高分子材料；粘結(jié)帶；集成電路
Abstract：Make a brief introduction of electric equipment industry S new technology for information transfer from small size and light weight to high speed and capacity，and tridimensional assembly and electrocircult technology for electric component and instrument S need of miniaturization， high density， micro wire and the shortest wire splice．Dissertate macromolecular material and expect for its perform ance，and interface
control technology of metal and macromolecular material connect．Also refor to interface control technology application such as multi—layers board， multi—conductor package material， the different tropism electric conduction material，adhesives tape for multi-conductor manufacture and SO on．
Key word：system in package；micro interconnection；polymer；adhesive tape； integrated circui