為達到微小芯片粘貼系統(tǒng)高精度的性能要求，以二極管粘片機為例在系統(tǒng)分析微小芯片粘貼系統(tǒng)運動控制的各誤差因素的基礎(chǔ)上，提出了誤差校正的方法。特別針對微小芯
片粘貼系統(tǒng)的高精度要求，采用了全閉環(huán)控制、視覺定位等先進技術(shù)。校正方法在具體工作中校正效果良好，對精度提高作用很大。
關(guān)鍵詞：誤差校正；運動控制；視覺定位；粘片機
Abstract: In order to fulfill high demand of precision in the microchip bonding system. Based on the analysis of every error in the system, the paper presents the method for error adjusting. And aiming especially at the high demand of precision, the advanced technology of full closed loop control and visual locating has been carried out. The method has been proved very efficient for adjusting in the practical project and greatly improves the precision of system.
Key words: error adjusting；movement control；visual locating；die bonder