微電子機(jī)械系統(tǒng)技術(shù)的特點(diǎn)是可使制品微型化、集成化并以硅作為加工材料。該技術(shù)可分為體微機(jī)械加工、表面微機(jī)械加工、金屬微機(jī)械加工和復(fù)合微機(jī)械加工四類。所采用的基礎(chǔ)技術(shù)主要有：腐蝕技術(shù)、硅鍵合技術(shù)、多層無應(yīng)力薄膜沉積技術(shù)、犧牲層技術(shù)、LIGA 技術(shù)以及以上技術(shù)的復(fù)合，該項(xiàng)技術(shù)應(yīng)用廣泛。本文重點(diǎn)介紹在微傳感器、
微電機(jī)、機(jī)械濾波器和諧振濾波器等方面的應(yīng)用，并探討了發(fā)展方向。
關(guān)鍵詞:微電子機(jī)械系統(tǒng)；微機(jī)械加工技術(shù)；MEMS 應(yīng)用

Abstract: Microelectromechanical system (MEMS) technology makes it possible the moralization and integration of the products based on the material of silicon. This technology is divided into four categories: body, surface, metal and compound micromechanical processes. The basic technologies included in the micromechanical system are erosion, si-bond, multiplayer film sediment without stress, sacrifice layer, LIGA and the combined technologies based on them. The applications of
micro-sensors, micro-machines, mechanism filter and resonant filters are presented, and the further development of technology
is discussed.
Key words: micromechanical system; micro-machining; application of MEMS